With the development of big data, cloud computing, and 5G communications, the server/storage industry has great potential. Servers have high-speed CPU computing power, long-time reliable operation, powerful I/O external data throughput and better scalability. We focus on providing high-speed boards and high-multilayer boards with high reliability, high stability, and high fault tolerance required for server quality.
●High-frequency PCB board product applications:
(1).Wireless communications: high-frequency microwave RF line PCB board technology design can be used in 5G communications, satellite communications, radio frequency identification and other wireless communication systems, to achieve high-speed, low-noise, high-precision signal transmission.
(2).Computer field: PCB is widely used in computer hardware, such as motherboards, graphics cards, hard disk controllers, memory and other equipment, used to connect various chips and transfer signals.
●What is High Frequency High Speed PCB?
Generally speaking, high-frequency and high-speed PCB boards refer to printed circuit boards with a frequency of 1GHz or more, and this definition may not be the same in the industry. Its various physical properties, precision, and technical parameters require very high, commonly used in communication systems, automotive ADAS systems, satellite communication systems, radio systems and other fields.
In addition, a device has a digital processing and interface component in addition to the RF system. Driven by a variety of consumer demands for faster Internet connectivity, mobile HD video, and the Internet of Things, PCB boards must also support the need for high-speed digital data transfers.Business applications such as IoT, 5G, and big data centers, as well as a growing number of personal applications, continue to refresh the requirements for digital communication system rates. Statistically, bandwidth for high-speed digital systems is almost doubling every three years driven by data rates, as shown in the table below.
●What are the important parameters of high frequency and high speed PCB?
High-frequency and high-speed PCB board and ordinary PCB board production process is basically the same, to achieve high-frequency and high-speed of the key point lies in the properties of the raw material, that is, the characteristics of the raw material parameters. The main material of high-frequency and high-speed PCB is high-frequency and high-speed copper-clad board, and its core requirement is to have a low dielectric constant (Dk) and low dielectric loss factor (Df). In addition to ensuring a low Dk and Df, the consistency of the Dk parameter is also one of the important factors in measuring the quality of PCB boards. Another important parameter is the impedance characteristics of the PCB board and some other physical characteristics.
●Reasonable use of multilayer board for PCB wiring
In the actual design process of the PCB board, most engineers will choose to use multilayer board to complete the high-speed signal wiring, multilayer board is an effective means of reducing circuit interference. In the use of multilayer board to complete the PCB high-speed signal circuit design, engineers need to reasonably select the number of layers to reduce the size of the printed circuit board, make full use of the intermediate layer to set up shielding, to achieve the proximity of the ground, can effectively reduce parasitic inductance, shorten the length of the signal transmission to reduce the signal cross-interference between, etc., all of which are very favourable to the work of the reliability of high-speed circuits.
Figure 1: Commonly used low-cost 6-layer board stacking scheme: there are two inner alignment layers.
Stacking should try to avoid two signal layers adjacent to each other, if unavoidable, as shown in Figure 1, the direction of alignment of these two adjacent layers must be taken as perpendicular to each other.
●In addition to the above mentioned several ways to use multi-layer board to enhance the reliability of PCB signal transmission, there is a part of the authoritative information shows that the same material when the four-layer board than the double-sided board noise is lower than 20dB. lead bends the less the better, the best use of the whole straight line, need to be folded, can be used to 45-degree folding or arc folding can reduce the high-speed signals to the external emission and mutual coupling to reduce the signal radiation and reflection. Reflection.
Contact: Ella Ouyang
Phone: 86-13570888065
Tel: 86-0755-28632299
Email: ellaouyang@szxpcba.com
Add: Building 8, Gangbei Industrial Zone, Huangtian, Xixiang, Bao’an District, Shenzhen, China.
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